Dongguan MENTO Intelligent Technology Co., Ltd.
Manufacturer of industrial production line inspection equipment
Add to Cart
M20 Series Mini LED appearance inspection
| Model | M2065 | ||||
| Inspection | Inspection items | Missed bonding, wrong bonding, die damaged, die offset, die tilted, die flipped, wrong polarity, particles, die lift-off, poor collinearity | |||
| Inspection method | Image processing, machine learning | ||||
| Optical System | Camera | 65MP | 25MP | 20MP | 12MP |
| Lens | High resolution bi-telecentric lens | ||||
| Resolution | 4μm(2.4μm~10μm optional)RGB(Customisable) | ||||
| Light Source | RGB customizable | ||||
| Efficiency | Stop then go:3FOV/s | Flying shoot:10FOV/s | |||
| Computer Configuration | PC | CPU:Inteli7, RAM:DDR4-32G, GPU:GTX1660-6GB SSD:250G, HDD:2T | |||
| Monitor | 22 "LED | ||||
| Operating System | Ubuntu | ||||
| Inspection Performance | PCB Thickness | 1~5mm | |||
| Maximum allowable component height | Upper 20mm, Lower 30mm(Customizable) | ||||
| Driver | Servo motor+Screw guide | ||||
| Movement speed | Max:600mm/s | ||||
| PCB fixture height | 900+20mm(from floor to fixture surface) | ||||
| Parameters | PCB size | Max:600mmx500mm(single track, track width adjustable) | |||
| Power | AC220W50Hz2000W | ||||
| Dimensions | W1350xD1000xH1650mm(without alarm light) | ||||
| Weight | ≈1100KG | ||||
| Air Pressure Requirement | ≥0.5Mpa | ||||
| Environmental requirements | Temperature:5~40℃, RH 25%~80%(no frost) | ||||
| Upstream and downstream equipment communication | Standard SMEMA interface / data communication with die bonder | ||||
Pad measurement/Pad inspection /Solder paste printer/SPI/Die bonder/Pre-reflow AOI/
Reflow oven/Post-reflow AOI /Luminescence inspection/Colloid inspection/Laser Marker/Rework